BOSTON, October 12, 2022 /PRNewswire/ — Semiconductors are the essential component that enables our digital lives. Their development has come a long way; In 1971, the Intel 4004, which was the first single-chip processor, had only 2,250 numbers of transistors, in 2022, the most advanced processor has more than 50 billion numbers of transistors! However, advancement comes at a price – development and production costs have increased to the point that the industry is looking for an alternative solution to manage costs while continuing to deliver advanced products. Along with this is the demand for smaller devices, the need for compact integration of heterogeneous components, and the need for higher interconnect densities, which is why advanced semiconductor packaging has entered the front of the stage.
In this article, we will cover the growth drivers of advanced semiconductor packaging technologies on data center applications, as well as several examples of leading commercial server products that are adopting advanced semiconductor packaging technologies. The content of this article comes from IDTechEx’s recently released market research report, “Advanced Semiconductor Packaging 2022-2033The applications of advanced semiconductor packaging technologies covered in the report go beyond data centers, autonomous vehicles, 5G and 6G, and consumer electronics.
Advanced semiconductor packaging technologies – An essential foundation for next-generation integrated circuits for high-performance computing/data center applications
When designing an energy-efficient system for high-performance computing (HPC) applications and data centers, there are three Si-related trends: more transistors, more memories, and more interconnects between the logic integrated circuit and memory. More transistors would require, among many challenges, chip design to go beyond the reticle limit, which is beyond the scope of advanced semiconductor packages. On the other hand, more memory, which can be achieved through high-bandwidth on-chip memory as well as increased I/O count, and more interconnects between the logic IC and memory, both can be achieved by advanced semiconductor packaging technologies.
Besides technological improvement, cost management also remains a key topic in this area. Chip design has emerged as a way to help the vendor strike the balance between cost and performance. Chip design is a modular approach to building processors. With chip design, different dies/chips can be created using the most suitable process node, reducing the total cost of the device by reducing the use of the (expensive!) peak process node. for unnecessary parts. Another driver for chiplet design is the need for more I/O. The packaging of I/O matrices such as SerDes, PCIE, memory I/O, etc. the same module with processing units using 2.5D or equivalent semiconductor packaging technology can increase the number of I/Os in a system. The advanced 2.5D semiconductor package is the only technology available today that enables submicron routing.
State-of-the-art use cases and future development trends
Let’s take a look at some of the more recent commercial products that have used or are likely to implement advanced semiconductor packaging technologies in this industry. Take the example of adoption in the server processor. With the majority of current server processors being based on monolithic SoCs (system on a chip), Intel announced in 2021 that its next-generation server processor, Sapphire Rapids, will be based on a four-chip module interconnected via Embedded Multi-die Interconnect Bridge (EMIB). EMIB is Intel’s advanced 2.5D semiconductor packaging solution. Meanwhile, AMD is harnessing the power of advanced 3D semiconductor packaging technologies to stack a cache chip directly on the processor to improve the performance of its latest Milan-X server processor (products released in March 2022) . AMD claims that 3D packaging allows >200x interconnect density compared to traditional 2D packaging. With both the #1 and #2 server processor vendors utilizing advanced semiconductor packaging technologies in their latest cutting-edge product, industry adoption of advanced semiconductor packaging technologies is expected to of semiconductors is only expanding. In addition to server processors, for other data center components, such as accelerators, advanced semiconductor packaging technology has also already been adopted. For example, NVIDIA has been using TSMC’s 2.5D packaging technology – CoWoS (Chip on Wafer on Substrate) – for its high-end GPU accelerators since 2016.
Although several high-end commercial products have already used advanced 2.5D semiconductor packaging technologies, many development initiatives are currently underway to further improve the performance of these devices and expand the package size to accommodate components. additional. Development will progress beyond 2.5D integration. Ultimately, the goal is to have a completely 3D integration where many logic ICs and memory are physically placed on top of each other. However, the road is not easy. Thermal management and manufacturing face several issues that have yet to be overcome.
Finally, given the growing need for data centers around the world, advances in advanced semiconductor packaging technologies, which are crucial for the next generation of integrated circuits (ICs) for high-performance computing applications, will influence considerable in the market.
“Advanced Semiconductor Packaging 2023-2033”, a new market research report from IDTechEx, examines the latest developments and trends in advanced semiconductor packaging technology, key players’ analysis and outlook. of the market.
Listed below are the main aspects of the report:
Technology Trends, Manufacturers Analysis and Market Outlook
– Detailed Overview of the Si IC Industry – including Technology Roadmap and Player Dynamics
– Analysis of the supply chain and business model in the semiconductor industry
– Analysis of different semiconductor packaging technologies
– In-depth analysis of the company’s key advanced semiconductor packaging technologies – including the company’s cutting-edge technology and future research development
– Detailed overview of key markets for advanced semiconductor packaging. Including high performance computing, autonomous vehicles, 5G and consumer electronics
– Numerous case studies demonstrating the use of advanced semiconductor packages in various applications
– Market scalability of leading advanced semiconductor packaging technologies (including 2.5D integrated Si, 2.5 Si interposer, 2.5D high density distribution (Ultra) and 3D die stacking) in the four main markets (Data Center, Autonomous Vehicles, 5G, Consumer Electronics) studied by IDTechEx. This information is translated into granular 10-year forecasts and market analysis
To learn more about this IDTechEx report, including sample downloadable pages, please visit www.IDTechEx.com/ASP.
IDTechEx’s market research is differentiated by primary information gathered, technical depth and unbiased assessments, IDTechEx covers a wide range of topics and helps understand industry pain points and unmet needs. For more information, visit www.IDTechEx.com/research.
IDTechEx guides your strategic business decisions through its research, subscription and advisory products, helping you take advantage of emerging technologies. For more information, contact [email protected]x.com or visit www.IDTechEx.com.
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