“India is a special market for Intel”

Chip giant Intel recently said it plans to regain its lead by 2025 and outlined five sets of chip manufacturing technologies it will deploy over the next four years. The company is also changing its naming scheme for chip-making technology, using names like “Intel 7” that match the way companies like. TSMC competing technologies on the market. In an email interaction, Prakash Mallya, group vice president and general manager of sales, marketing and communications, Intel India spoke about the company’s strategy.
Intel is rethinking its versions, what is behind this new rebranding? What does Intel’s new roadmap actually mean for users in terms of products to market and performance improvements?
The chip industry has long recognized that the traditional nanometer-based process has not matched the actual gate length metric since 1997. Intel is updating its naming lexicon to create a clear, consistent, and meaningful framework for use by industry.
Our new name will help analysts, partners and customers make more informed decisions as we enter what we are calling the Angstrom era of semiconductors. Angstroms are units of measurement smaller than nanometers. The first chip that will be measured in Angstroms will be the Intel 20A, which will feature a brand new architecture called RibbonFET.
After FinFET, RibbonFET and PowerVia are two major technologies that Intel relies on. Can you please reveal more details on how these two technologies will help Intel?
Intel 20A marks the beginning of the Angstrom era of semiconductors where we manufacture devices and materials at the atomic level. It will feature two technologies: a brand new transistor architecture called RibbonFET and a one-of-a-kind innovation called PowerVia to improve power delivery. We are going to present Door all around (GAA) with Intel 20A, our first new transistor architecture since we launched FinFETs in 2011. GAA has been in development in the industry for several years. The name comes from the architecture of the transistor where the gate is wrapped around the channel. We call our version of GAA RibbonFET. We anticipate that the first product for RibbonFET will be a leading customer solution.
PowerVia will be the industry’s first deployment of rear power distribution network technology when introduced with Intel20A. It drastically reduces the need for power supply routing on the front face of the board by feeding the power supply from the rear, allowing more resources to be available to optimize signal routing and hence reduce signal delays.
There appears to be a resurgence of interest in packaging technologies in the chip industry. What does this mean exactly?
Advanced packaging offers a whole new modular approach to chip manufacturing that is faster and more cost effective than traditional methods of designing systems in large monolithic silicon chips. The bottom line for customers is Intel’s ability to build more capacity into each new generation of products and stay within the same cost, power and physical footprints. Advanced packaging also allows Intel to design chips to specific customer requirements. By allowing a customer to differentiate themselves in their markets by giving them the flexibility to choose features, components and a process node, we are able to meet a range of design requirements for an even wider range of ‘applications.
Packaging is a crucial part of Intel’s IDM 2.0 strategy, as it allows us to create products incorporating disparate nodes and processes as we adapt and stack tiles vertically to continue to advance Moore’s Law. , which allows us to continue to meet our customers’ needs for better compute performance. Our advantage is the ability to mix and match all major advanced packaging capabilities to create products.
Do you think Intel’s India operations play a specific role in this new journey?
India has demonstrated its strengths in software development, an innovative startup ecosystem and huge local talent to develop for local and global clients. When you combine these local market strengths with an emerging hardware ecosystem and supporting policies, the country has the edge it needs to lead in this era of rapid digitization. India is a particular market for Intel. We have been operating here for over two decades and have thousands of employees working at our design facilities in Bangalore and Hyderabad. We work closely with our supply chain partners and leverage our IDM capabilities. Bengaluru remains Intel’s second largest design center in the world.
There is an explosion in demand for silicon in all industries and applications. Are there any specific opportunities you see for Intel India?
The demand for silicon is exploding in many applications. The proliferation of hybrid cloud offers new levels of efficiency and scalability for businesses, and the growth of the cloud is leading to the democratization of high performance computing. We see artificial intelligence (AI) and Machine learning (ML) more and more infused in each application. The rapid adoption of 5G is fueling new use cases that demand lower latencies and higher bandwidth and in turn drive computing at the edge. The confluence of these trends is leading to the largest and fastest computer construction in human history.
What do you think of the shortage of crisps? When do you see it ending?
Digitizing everything creates exciting and sustainable growth that is expected to last a decade or more. 2021 is shaping up to be the largest total addressable PC market (TAM) already. We also expect continued growth in 2022 as PC density increases, penetration increases, and refresh rates decrease. The high demand environment will continue to strain supply chains across the industry. These opportunities and challenges are the main reasons why we predict that it will take 1 to 2 years for the industry to fully catch up and meet customer demand at a steady pace.

Previous Arista Networks Expands Routing Solutions to the Network Edge
Next No Way Home trailer just got an absolutely amazing remix

No Comment

Leave a reply

Your email address will not be published.