Pixus Demonstrates Backplane Design Capability Above 100GbE – EEJournal


Waterloo, Ontario – November 16, 2022 – Pixus Technologies, a provider of computing solutions and embedded enclosures, has developed a high-performance backplane with signals in excess of 28 Gbaud in the backplane slots. The design leverages the 6U OpenVPX form factor and VITA 66/67 RF and optical interfaces, but uses a special high-speed connector for the fastest data rates.

The backplane has 14 slots with RF and optical interfaces through the backplane to the rear panel of a Pixus RiCool chassis. The company uses high-quality PCB materials, counter-borings, and specialized routing strategies to optimize signal performance. For speeds of PCIe Gen4 (16 Gbaud/sec) or greater, the company typically performs Signal Integrity (SI) studies to help ensure high-speed signal performance. The SI results of these backplanes showed great results with large eye chart openings etc.

Pixus offers backplane/enclosure solutions aligned with SOSA™, OpenVPX and other modular open standard architectures. The company also offers various specialty boards in various standards, including power interface boards, alarm boards, chassis managers, and more.

About Pixus Technologies

Backed by over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronic packaging. Founded in 2009 by senior management of Kaparel Corporation, a Rittal company, Pixus Technologies backplanes and embedded systems primarily focus on ATCA, OpenVPX, MicroTCA and custom designs. Pixus also offers an extensive offering of VME and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorized North and South American supplier of electronic packaging products previously offered by Kaparel Corporation and Rittal.

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